Semiconductor system

ABSTRACT

A semiconductor system may include first semiconductor device including a first pad, a second pad and a first test input pad, and suitable for storing data inputted in series through the first test input pad and outputting the stored data in parallel through the first pad and the second pad; a second semiconductor device including a third pad, a fourth pad and a second test output pad, and suitable for storing data inputted in parallel through the third pad and the fourth pad, a first through via connecting the first pad and the third pad so that the stored data outputted in parallel through the first pad is inputted in parallel through the third pad; and a second through via connecting the second pad and the fourth pad so that the stored data outputted in parallel through the second pad is inputted in parallel through the fourth pad.

CROSS-REFERENCE TO RELATED APPLICATIONS

The present application claims priority of Korean Patent Application No.10-2013-0133532, filed on Nov. 5, 2013, which is incorporated herein byreference in its entirety.

BACKGROUND

1. Field

Various embodiments of the present invention relate to a semiconductorsystem and more particularly to a semiconductor system capable oftesting through vias connecting the semiconductor devices included inthe semiconductor system.

2. Description of the Related Art

As semiconductor devices trend toward high performance and a high degreeof integration, the number of interface pads for exchanging data hasincreased. Generally, semiconductor device may use a boundary scan testto check whether or not a fail has occurred in a junction state betweenan external input channel and an interface pad. The boundary scan testrefers to a scheme in which test data are transferred to correspondinginterface pads through a plurality of input channels. The test datatransferred through the interface pads are buffered and latchedinternally and are outputted to an outside of a semiconductor devicethrough boundary scan paths. The outputted data are scanned to checkwhether or not a fail has occurred in a junction state.

Semiconductor devices, such as a DRAM, have undergone changes to satisfyvarious demands. Among these changes, may be a change in a structuralaspect. An example of a change in a structural aspect is a multi-chippackage (MCP). The multi-chip package is a package chip which includes aplurality of chips. Packaging technologies for semiconductor deviceshave been developed to meet demands for miniaturization and highcapacity. Various technologies for a stack package capable of satisfyingnot only miniaturization and high capacity but also mounting efficiencyare being developed.

A stack package may be fabricated by a method in which individualsemiconductor chips are stacked then the stacked semiconductor chips arepackaged together or a method in which individual packaged semiconductorchips are stacked. Stacked semiconductor packages employingthrough-silicon vias (TSVs) are becoming widely used. The stackedsemiconductor package is realized by defining via holes to pass throughsemiconductor devices, filling a conductive material in the via holesthus forming through electrodes which are called the through-siliconvias, and electrically connecting stacked semiconductor devices by thethrough electrodes.

The stacked semiconductor package may operate normally only when thethrough-silicon vias are properly formed. Accordingly, whether or notthrough-silicon vias are normally formed is tested in a variety of waysin the fabricating procedure of a semiconductor package.

SUMMARY

Various embodiments are directed to a semiconductor system capable oftesting whether or not through vias connecting the semiconductor devicesincluded in the semiconductor system are normally formed.

Additionally, various embodiments are directed to a semiconductor systemcapable of minimizing a circuit area necessary for testing through vias,by performing a test using a circuit included in a semiconductor device.

In an embodiment according to the present invention, a semiconductorsystem may include, a first semiconductor device including a first pad,a second pad and a first test input pad, suitable for storing datainputted in series through the first test input pad and outputting thestored data in parallel through the first pad and the second pad, asecond semiconductor device including a third pad, a fourth pad and asecond test output pad, suitable for storing data inputted in parallelthrough the third pad and the fourth pad, a first through via connectingthe first pad and the third pad, and a second through via connecting thesecond pad and the fourth pad.

The first semiconductor device may include a first test output pad, afirst selection unit suitable for selecting one of the data inputtedthrough the first test input pad and data inputted through the firstpad, a first storage unit suitable for storing and outputting the dataselected by the first selection unit, a second selection unit suitablefor selecting one of the data outputted from the first storage unit anddata outputted from a first internal circuit, a third selection unitsuitable for selecting one of the data outputted from the first storageunit and data inputted through the second pad, a second storage unitsuitable for storing and outputting the data selected by the thirdselection unit, and a fourth selection unit suitable for selecting oneof the data outputted from the second storage unit and the dataoutputted from the first internal circuit.

The second semiconductor device may include a second test input pad, afifth selection unit suitable for selecting one of data inputted throughthe second test input pad and data inputted through the third pad, athird storage unit suitable for storing and outputting the data selectedby the fifth selection unit, a sixth selection unit suitable forselecting one of the data outputted from the third storage unit and dataoutputted from a second internal circuit, a seventh selection unitsuitable for selecting one of the data outputted from the third storageunit and data inputted through the fourth pad, a fourth storage unitsuitable for storing and outputting the data selected by the seventhselection unit, and an eighth selection unit suitable for selecting oneof the data outputted from the fourth storage unit and the dataoutputted from the second internal circuit.

In another embodiment according to the present invention, asemiconductor system may include first to N^(th) semiconductor deviceseach having a plurality of pads, the first to N^(th) semiconductordevices being sequentially stacked so that the plurality of pads ofadjacent semiconductor devices may be connected by through vias. Thefirst semiconductor device may further include a test input pad, storesdata inputted in series through the test input pad, and outputs inparallel the stored data through corresponding pads among the pluralityof pads. The N^(th) semiconductor device may further include a testoutput pad, stores the data inputted in parallel through thecorresponding pads among the plurality of pads, and outputs in seriesthe stored data through the test output pad.

In another embodiment according to the present invention, asemiconductor system may include a first semiconductor device includinga first pad, a second pad, a first test input pad, a first output bufferwhich has a first resistance value and drives the first pad with avoltage corresponding to an output value and a second output bufferwhich has the first resistance value and drives the second pad with avoltage corresponding to an output value, and suitable for storing datainputted in series through the first test input pad and outputting thestored data in parallel through the first pad and the second pad, asecond semiconductor device including a third pad, a fourth pad, asecond test input pad, a second test output pad, a third output buffer,which has a second resistance value larger than the first resistancevalue and drives the third pad with a voltage corresponding to an outputvalue and a fourth output buffer which has the second resistance valueand drives the fourth pad with a voltage corresponding to an outputvalue, and suitable for inputting in series and storing data through thesecond test input pad, which are different from the data inputtedthrough the first test input pad, and outputting in parallel the storeddata through the third pad and the fourth pad, a first through viaconnecting the first pad and the third pad, and a second through viaconnecting the second pad and the fourth pad.

The first semiconductor device may further include a first test outputpad, a first selection unit suitable for selecting one of data inputtedthrough the first test input pad and data inputted through the firstpad, a first storage unit suitable for storing and outputting the dataselected by the first selection unit, a second selection unit suitablefor selecting one of the data outputted from the first storage unit anddata outputted from a first internal circuit, a third selection unitsuitable for selecting one of the data outputted from the first storageunit and data inputted through the second pad, a second storage unitsuitable for storing and outputting the data selected by the thirdselection unit, and a fourth selection unit suitable for selecting oneof the data outputted from the second storage unit and the dataoutputted from the first internal circuit.

The second semiconductor device may further include a fifth selectionunit suitable for selecting one of data inputted through the second testinput pad and data inputted through the third pad, a third storage unitsuitable for storing and outputting the data selected by the fifthselection unit, a sixth selection unit suitable for selecting one of thedata outputted from the third storage unit and data outputted from asecond internal circuit, a seventh selection unit suitable for selectingone of the data outputted from the third storage unit and data inputtedthrough the fourth pad, a fourth storage unit suitable for storing andoutputting the data selected by the seventh selection unit, and aneighth selection unit suitable for selecting one of the data outputtedfrom the fourth storage unit and the data outputted from the secondinternal circuit.

In another embodiment according to the present invention, asemiconductor system may include first to N^(th) semiconductor deviceseach including a plurality of pads, the first to N^(th) semiconductordevices being sequentially stacked so that the plurality of pads ofadjacent semiconductor devices may be connected by through vias,respectively. The first semiconductor device includes a first test inputpad and a plurality of first output buffers which have a firstresistance value and drive the plurality of corresponding pads withvoltages corresponding to output values, stores data inputted in seriesthrough the first test input pad, and outputs in parallel the storeddata through the plurality of pads. The N^(th) semiconductor deviceincludes an N^(th) test input pad, an N^(th) test output pad and aplurality of N^(th) output buffers, which have a second resistance valuelarger than the first resistance value and drive the plurality ofrespective pads with voltages corresponding to output values, inputs inseries and stores through the N^(th) test input pad, which are differentfrom the data inputted through the first test input pad, and outputs inparallel the stored data through the plurality of pads.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a diagram illustrating a semiconductor system in accordancewith an embodiment of the present invention;

FIG. 2 is a diagram illustrating a semiconductor system in accordancewith an embodiment of the present invention;

FIG. 3 is a diagram illustrating the first semiconductor device shown inFIG. 2;

FIG. 4 is a diagram illustrating a semiconductor system in accordancewith an embodiment of the present invention;

FIG. 5 is a diagram explaining the principle of a via test operation inthe semiconductor system of FIG. 4;

FIG. 6 is a diagram illustrating a semiconductor system in accordancewith an embodiment of the present invention;

FIG. 7 is a diagram illustrating the first semiconductor device shown inFIG. 6; and

FIG. 8 is a diagram illustrating an output buffer.

DETAILED DESCRIPTION

Various embodiments will be described below in more detail withreference to the accompanying drawings. The present invention may,however, be embodied in different forms and should not be construed aslimited to the embodiments set forth herein. Rather, these embodimentsare provided so that this disclosure will be thorough and complete, andwill fully convey the scope of the present invention to those skilled inthe art. Throughout the disclosure, like reference numerals refer tolike parts throughout the various figures and embodiments of the presentinvention.

The drawings are not necessarily to scale and in some instances,proportions may have been exaggerated to clearly illustrate features ofthe embodiments. It should be readily understood that the meaning of“on” and “over” in the present disclosure should be interpreted in thebroadest manner such that “on” means not only “directly on” but also“on” something with an intermediate feature(s) or a layer(s)therebetween, and that “over” means not only directly on top but also ontop of something with an intermediate feature(s) or a layer(s)therebetween. It is also noted that in this specification,“connected/coupled” refers to one component not only directly couplinganother component but also indirectly coupling another component throughan intermediate component. In addition, a singular form may include aplural form as long as it is not specifically mentioned in a sentence.

FIG. 1 is a diagram illustrating a semiconductor system in accordancewith an embodiment of the present invention.

Referring to FIG. 1, a semiconductor system may include through viasTSV1 and TSV2, a first semiconductor device 110, and a secondsemiconductor device 120. The first semiconductor device 110 may includepads PAD1 and PAD2, a first test input pad TI_PAD1, a first test outputpad TO_PAD1, input buffers 111_1 and 111_2, output buffers 112_1 and112_2, a first test input buffer 113, a first test output buffer 114,storage units 115_1 and 115_2, selection units 116_1 to 116_4, a firsttest control unit 117, and a first internal circuit 118. The secondsemiconductor device 120 may include pads PAD3 and PAD4, a second testinput pad TI_PAD2, a second test output pad TO_PAD2, input buffers 121_1and 121_2, output buffers 122_1 and 122_2, a second test input buffer123, a second test output buffer 124, storage units 125_1 and 125_2,selection units 126_1 to 126_4, a second test control unit 127, and asecond internal circuit 128. The first pad PAD1 and the third pad PAD3may be connected through the first through vias TSV1, and the second padPAD2 and the fourth pad PAD4 may be connected through the second throughvias TSV2. The second semiconductor device 120 may be a master chip,which performs communication with an outside, and the firstsemiconductor device 110 may be a slave chip.

The first semiconductor device 110 may input/output data through thefirst pad PAD1 and the second pad PAD2. The first semiconductor device110 may be a memory device. When the first semiconductor device 110 is amemory device, the first pad PAD1 and the second pad PAD2 may be padsfor being inputted with commands or addresses or pads forinputting/outputting data. The first input buffer 111_1 and the secondinput buffer 111_2 may respectively correspond to the first pad PAD1 andthe second pad PAD2, and may buffer the data inputted through thecorresponding pads. The first output buffer 112_1 and the second outputbuffer 112_2 may respectively correspond to the first pad PAD1 and thesecond pad PAD2, and may buffer data to be outputted to thecorresponding pads.

In a test operation, the first semiconductor device 110 may be inputtedwith data through the first test input pad TI_PAD1 and may output storeddata to the first test output pad TO_PAD1. The first test input buffer113 may buffer the data inputted through the first test input padTI_PAD1, and the first test output buffer 114 may buffer data to beoutputted to the first test output pad TO_PAD1.

The first selection unit 116_1 may select one of the data inputtedthrough the first test input pad TI_PAD1 and the data inputted throughthe first pad PAD1. The first storage unit 115_1 may store and outputthe data selected by the first selection unit 116_1. The secondselection unit 116_2 may select one of the data outputted from the firststorage unit 115_1 and the data outputted from the first internalcircuit 118. The third selection unit 116_3 may select one of the dataoutputted from the first storage unit 115_1 and the data inputtedthrough the second pad PAD2. The second storage unit 115_2 may store andoutput the data selected by the third selection unit 116_3. The dataoutputted from the second storage unit 115_2 may be transferred to thefirst test output pad TO_PAD1. The fourth selection unit 116_4 mayselect one of the data outputted from the second storage unit 115_2 andthe data outputted from the first internal circuit 118. The firststorage unit 115_1 and the second storage unit 115_2 may be D-flipflops, which operate in synchronization with a clock ICK1.

The first test control unit 117 may generate a plurality of controlsignals SEL1, SEL2, OUT1, T_OUT1 and ICK1 in response to a plurality ofexternal signals CMDs and TCK, which are transferred from an outside ofthe first semiconductor device 110. CMDs may be command signals forsetting the operations of the first semiconductor device 110, and TCKmay be the source signal of the clock ICK1 used in a test. The commandsignals CMDs may include a command signal, which is applied to only thefirst semiconductor device 110, and a command signal, which is appliedto both the first semiconductor device 110 and the second semiconductordevice 120. The first semiconductor device 110 may perform a differentoperation from the second semiconductor device 120, by applying thecommand signal to only the first semiconductor device 110. Additionally,the first semiconductor device 110 may include pads and through vias forapplying a plurality of external signals CMDs and TCK.

A first select signal SEL1 is a signal for controlling the firstselection unit 116_1 and the third selection unit 116_3, a second selectsignal SEL2 is a signal for controlling the second selection unit 116_2and the fourth selection unit 116_4, a first output signal OUT1 is asignal for controlling the first output buffer 112_2 and the secondoutput buffer 112_2, and a first test output signal T_OUT1 is a signalfor controlling the first test output buffer 114.

The first internal circuit 118 may perform a predetermined operation inresponse to the signals inputted through the first pad PAD1 and thesecond pad PAD2, and may output a result of the predetermined operationto the first pad PAD1 and the second pad PAD2. When the firstsemiconductor device 110 is a memory device, in a write operation, thefirst internal circuit 118 may store the data inputted through the firstpad PAD1 and the second pad PAD2, or in a read operation, may outputstored data through the first pad PAD1 and the second pad PAD2.

The descriptions of the pads PAD3 and PAD4, the second test input padTI_PAD2, the second test output pad TO_PAD2, the input buffers 121_1 and121_2, the output buffers 122_1 and 122_2, the second test input buffer123, the second test output buffer 124, the storage units 125_1 and125_2, the selection units 126_1 to 126_4, the second test control unit127 and the second internal circuit 128 of the second semiconductordevice 120 are respectively the same as the descriptions of the padsPAD1 and PAD2, the first test input pad TI_PAD1, the first test outputpad TO_PAD1, the input buffers 111_1 and 111_2, the output buffers 112_1and 112_2, the first test input buffer 113, the first test output buffer114, the storage units 115_1 and 115_2, the selection units 116_1 to116_4, the first test control unit 117 and the first internal circuit118 of the first semiconductor device 110.

The second test control unit 127 of the second semiconductor device 120may generate a plurality of control signals SEL3, SEL4, OUT2, T_OUT2 andICK2 in response to a plurality of external signals CMDs and TCK. Thecommand signals CMDs may include a command signal, which is applied onlyto the second semiconductor device 120.

In a via test operation, the semiconductor devices 110 and 120 maygenerally perform four operations: a serial input operation, a serialoutput operation, a parallel input operation and a parallel outputoperation. The four operations will be described referring to the firstsemiconductor device 110. Internal docks ICK1 and ICK2 may be activatedin the test operation.

When the command signals CMDs correspond to a serial input operation,the first test control unit 117 may generate the first select signalSEL1 so that the first selection unit 116_1 selects the data inputtedthrough the first test input pad TI_PAD1 and the third selection unit116_3 selects the data outputted from the first storage unit 115_1. Thefirst storage unit 115_1 and the second storage unit 115_2 may perform ashifting operation in response to the internal clock ICK1. Therefore, if2 or more-bit data are inputted in series through the first test inputpad TI_PAD1, the inputted data may be stored in the second storage unit115_2 through the first storage unit 115_1. For example, when storing2-bit data, if a first inputted bit is “1” and a second inputted bit is“0”, the first inputted bit may be shifted to the second storage unit115_2 through the first storage unit 115_1 and may be stored in thesecond storage unit 115_2, and the second inputted bit may be stored inthe first storage unit 115_1. That is, “0” may be stored in the firststorage unit 115_1, and “1” may be stored in the second storage unit115_2.

When the command signals CMDs correspond to a serial output operation,the first test control unit 117 may generate the first select signalSEL1 so that the third selection unit 116_3 selects the data outputtedfrom the first storage unit 115_1 and may generate the first test outputsignal T_OUT1 so that the first test output buffer 114 is activated. Thefirst storage unit 115_1 and the second storage unit 115_2 may perform ashifting operation in response to the internal clock ICK1. Therefore thedata stored in the second storage unit 115_2 and the data stored in thefirst storage unit 115_1 may be sequentially outputted to the first testoutput pad TO_PAD1. For example, when “0” is stored in the first storageunit 115_1 and “1” is stored in the second storage unit 115_2, the “1”stored in the second storage unit 115_2 may be outputted first, and thenthe “0” stored in the first storage unit 115_1 may be outputted throughhe second storage unit 115_2.

When the command signals CMDs correspond to a parallel input operation,the first test control unit 117 may generate the first select signalSEL1 so that the first selection unit 116_1 selects the data inputtedthrough the first pad PAD1 and the third selection unit 116_3 selectsthe data inputted through the second pad PAD2. The first storage unit115_1 may store the data inputted through the first pad PAD1 in responseto the internal clock ICK1, and the second storage unit 115_2 may storethe data inputted through the second pad PAD2 in response to theinternal clock ICK1.

When the command signals CMDs correspond to a parallel output operation,the first test control unit 117 may generate the second select signalSEL2 so that the second selection unit 116_2 selects the data stored inthe first storage unit 115_1 and the fourth selection unit 116_4 selectsthe data outputted from the second storage unit 115_2. The first storageunit 115_1 and the second storage unit 115_2 may output stored data inresponse to the internal clock ICK1, and the data outputted from thefirst storage unit 115_1 may be outputted to the first pad PAD1, and thedata outputted from the second storage unit 115_2 may be outputted tothe second pad PAD2.

Hereinafter, the via test operation of the semiconductor system will bedescribed.

As the first semiconductor device 110 performs the serial inputoperation, the respective bits of the data serially inputted through thefirst test input pad TI_PAD1 may be stored in the first storage unit115_1 and the second storage unit 115_2. For example, in the case where“0” and “1” are sequentially inputted, “0” may be stored in the secondstorage unit 115_2 and “1” may be stored in the first storage unit115_1. For reference, the data inputted through the first test input padTI_PAD1 may be data with a preset pattern.

Next, the first semiconductor device 110 may perform the parallel outputoperation, and at the same time, the second semiconductor device 120 mayperform the parallel input operation. The “1” stored in the firststorage unit 115_1 may be outputted to the first pad PAD1 and may thenbe inputted to the third pad PAD3 through the first through via TSV1.Similarly, the “0” stored in the second storage unit 115_2 may beoutputted to the second pad PAD2 and may then be inputted to the fourthpad PAD4 through the second through via TSV2. A “1” inputted to thethird pad PAD3 may be stored in the third storage unit 125_1 and a “0”inputted to the fourth pad PAD4 may be stored in the fourth storage unit125_2. If the through vias TSV1 and TSV2 are normally formed, the datastored in the first storage unit 115_1 and the second storage unit 115_2may be stored the same in the third storage unit 125_1 and the fourthstorage unit 125_2. Otherwise, the data stored in the third storage unit125_1 and the fourth storage unit 125_2 may be different from the datastored in the first storage unit 115_1 and the second storage unit115_2.

Finally, as the second semiconductor device 120 performs the serialoutput operation, the data stored in the fourth storage unit 125_2 andthe data stored in the third storage unit 125_1 may be sequentiallyoutputted. In the above case, “0”and “1” may be sequentially outputted.

Since the data stored in the first semiconductor device 110 are normallytransferred to the second semiconductor device 120 when the through viasTSV1 and TSV2 are normally formed, the data sequentially inputtedthrough the first test input pad TI_PAD1 and the data sequentiallyoutputted through the second test output pad TO_PAD2 should have thesame pattern. Accordingly, by comparing the data sequentially inputtedthrough the first test input pad TI_PAD1 and the data sequentiallyoutputted through the second test output pad TO_PAD2, it is possible todetermine whether or not the through vias TSV1 and TSV2 are normallyformed. To compare the two data, the semiconductor system may includeseparate storage units (not shown) in the semiconductor devices 110 and120 or may include test equipment (not shown), which is connected withthe semiconductor devices 110 and 120.

When the first semiconductor device 110 performs a normal data inputoperation such as a write operation, the data inputted through the padsPAD1 and PAD2 may be transferred to the first internal circuit 118. Whenthe first semiconductor device 110 performs a normal data outputoperation such as a read operation, the data transferred from the firstinternal circuit 118 may be outputted to the pads PAD1 and PAD2 throughthe selection units 116_2 and 116_4. Operations of the secondsemiconductor device 120 are similar to these descriptions.

The semiconductor system may test whether or not through vias arenormally formed by using the circuits, which perform the predeterminedoperations as described above. For increased efficiency, thesemiconductor system may perform a via test operation using circuits,which are included for another test, for example, a boundary scan test.

FIG. 2 is a diagram illustrating a semiconductor system in accordancewith an embodiment of the present invention.

The semiconductor system of FIG. 2 may include first to N^(th)semiconductor devices 210, CHIPs and 220. The first to N^(th)semiconductor devices 210, CHIPs and 220 may be stacked. In thesemiconductor system, the first semiconductor device 210 may be anuppermost stacked semiconductor device, the N^(th) semiconductor device220 may be a lowermost stacked semiconductor device, and the remainingsemiconductor devices CHIPs may be semiconductor devices which arestacked between the first semiconductor device 210 and the N^(th)semiconductor device 220. Each of the first to N^(th) semiconductordevices 210, CHIPs and 220 may include a plurality of pads P. Thepluralities of pads P of the semiconductor devices stacked adjacent toeach other may be connected through the through vias TSV. FIG. 2 showsonly respective pads P, TI and TO and through vias TSV of the first andN^(th) semiconductor devices 210 and 220 and the stacked shape of theremaining semiconductor devices CHIPs.

FIG. 3 is a diagram illustrating the first semiconductor device 210shown in FIG. 2. As shown in FIG. 3, the first semiconductor device 210may include pads P, a test input pad TI, a test output pad TO, inputbuffers IB, output buffers OB, a test input buffer TIB, a test outputbuffer TOB, storage units DFF, selection units MUX1 and MUX2, a testcontrol unit TCON, and an internal circuit ICIR.

The first semiconductor device 210 may input/output data through thepads P. Among the pads P, are command pads, address pads, and data pads.The input buffers IB may buffer the data inputted through the pads P andthe output buffers OB may buffer data to be outputted to the pads P.

Data to be stored in the first semiconductor device 210 may be inputtedin series through the test input pad TI in a serial input operation, andthe data stored in the first semiconductor device 210 may be outputtedin series through the test output pad TO in a serial output operation.The test Input buffer TIB may buffer the data inputted through the testinput pad TI, and the test output buffer TOB may buffer data to beoutputted through the test output pad TO.

Each selection unit MUX1, which is connected to the input terminal (D)of each storage unit DFF, may select one of the data outputted throughthe output terminal (Q) of the storage unit DFF corresponding to aprevious stage or the data inputted through the test input pad TI, andthe data inputted through the corresponding pad P. Each selection unitMUX2, which is connected to the output terminal (Q) of each storage unitDFF, may select one of the data outputted from the storage unit DFF andthe data outputted from the internal circuit ICIR.

The test control unit TCON may generate control signals SEL1, SEL2, OUT,T_OUT and ICK in response to a plurality of external signals CMDs andTCK. Additionally, the first semiconductor device 210 may include padsand through vias for applying a plurality of external signals CMDs andTCK, which are not shown for convenience in illustration.

When the command signals CMDs correspond to a serial input operation,the test control unit TCON may generate a first select signal SEL1 sothat each selection unit MUX1 selects the data outputted from thestorage unit DFF corresponding to a previous stage or the data inputtedthrough the test input pad TI. Each storage unit DFF may perform ashifting operation in response to an internal clock ICK. Therefore, thedata inputted through the test input pad TI may be sequentially storedin the storage units DFF, starting from the storage unit DFF, which isadjacent to the test output pad TO.

When the command signals CMDs correspond to a serial output operation,the test control unit TCON may generate the first select signal SEL1 sothat each selection unit MUX1 selects the data outputted from thestorage unit DFF corresponding to a previous stage, and may activate atest output signal T_OUT so that the test output buffer TOB isactivated. Each storage unit DFF may perform a shifting operation inresponse to the internal clock ICK. Therefore, the bits stored in thestorage units DFF may be sequentially outputted, starting from thestorage unit DFF which is adjacent to the test output pad TO.

When the command signals CMDs correspond to a parallel input operation,the test control unit TCON may generate the first select signal SEL1 sothat each selection unit MUX1 selects the data inputted to itscorresponding pad P. The data inputted to the corresponding pad P may bestored in response to the internal clock ICK.

When the command signals CMDs correspond to a parallel output operation,the test control unit TCON may generate a second select signal SEL2 sothat each selection unit MUX2 selects the data outputted from itscorresponding storage unit DFF. The storage unit DFF may output storeddata in response to the internal clock ICK, and the outputted data maybe outputted to the corresponding pad P.

The remaining semiconductor devices CHIPs and 220 have the sameconfiguration as the first semiconductor device 210, and the operationsof respective component elements thereof are the same as describedabove. Hereinafter, a via test operation of the semiconductor systemwill be described.

As the first semiconductor device 210 performs the serial inputoperation, the data inputted in series through the test input pad TI maybe stored in the plurality of storage units DFF. For reference, the datainputted through the test input pad TI may be data with a presetpattern.

Next, the first semiconductor device 210 may perform the parallel outputoperation, and at the same time, the N^(th) semiconductor device 220 mayperform the parallel input operation. The remaining semiconductordevices CHIPs may perform the parallel input operation similarly to theN^(th) semiconductor device 220. When through vias TSV are normallyformed, the data outputted to the plurality of pads P of the firstsemiconductor device 210 may be inputted to the plurality of pads P ofthe N^(th) semiconductor device 220 and may be stored in the pluralityof storage units DFF. Otherwise, data different from the data outputtedfrom the first semiconductor device 210 may be stored in the N^(th)semiconductor device 220.

As the N^(th) semiconductor device 220 performs the serial outputoperation, stored data may be sequentially outputted through the testoutput pad TO. By comparing the data inputted through the test input padTI of the first semiconductor device 210 and the data outputted throughthe test output pad TO of he N^(th) semiconductor device 220, a via testmay be performed.

When three or more semiconductor devices are stacked, a via test may beperformed by storing data in series in an uppermost stackedsemiconductor device and then storing the stored data in a lowermoststacked semiconductor device through parallel input/output operations.

FIG. 4 is a diagram illustrating a semiconductor system in accordancewith an embodiment of the present invention.

Referring to FIG. 4, a semiconductor system may include through viasTSV1 and TSV2, a first semiconductor device 410, and a secondsemiconductor device 420. The first semiconductor device 410 may includepads PAD1 and PAD2, a first test input pad TI_PAD1, a first test outputpad TO_PAD1, input buffers 411_1 and 411_2, output buffers 412_1 and412_2, a first test input buffer 413, a first test output buffer 414,storage units 415_1 and 415_2 selection units 416_1 to 416_4, a firsttest control unit 417, and a first internal circuit 418. The secondsemiconductor device 420 may include pads PAD3 and PAD4, a second testinput pad TI_PAD2, a second test output pad TO_PAD2 input buffers 421_1and 421_2 output buffers 422_1 and 422_2, a second test input buffer423, a second test output buffer 424, storage units 425_1 and 425_2,selection units 426_1 to 426_4, a second test control unit 427, and asecond internal circuit 428. The first pad PAD1 and the third pad PAD3may be connected through the first through via TSV1 and the second padPAD2 and the fourth pad PAD4 may be connected through the second throughvia TSV2. Additionally, the second semiconductor device 420 may be amaster chip, which performs communication with an outside, and the firstsemiconductor device 410 may be a slave chip.

In the semiconductor system of FIG. 4, the resistance values of theoutput buffers 412_1, 412_2, 422_1 and 422_2 may be controlled. In a viatest operation, the resistance values of the output buffers 412_1 and412_2 of the first semiconductor device 410 and the resistance values ofthe output buffers 422_1 and 422_2 of the second semiconductor device420 may be set differently from each other.

The configurations and operations of the semiconductor devices 410 and420 of FIG. 4 are similar to those of the first semiconductor device 110of FIG. 1. The semiconductor devices 410 and 420 of FIG. 4 may perform(1) a serial input operation, (2) a serial output operation, (3) aparallel input operation and (4) a parallel output operation accordingto the control thereof, similar to the first semiconductor device 110 ofFIG. 1. Hereinbelow, descriptions will be made primarily for the outputbuffers 412_1, 412_2, 422_1 and 422_2 of FIG. 4 and a via testoperation.

The first output buffer 412_1 and the second output buffer 412_2respectively correspond to the first pad PAD1 and the second pad PAD2,have a resistance value corresponding to first resistance informationR_INF1, and drive the corresponding pads with voltages corresponding tooutput values. In response to the first resistance information R_INF1,the first output buffer 412_1 and the second output buffer 412_2 mayhave a first resistance value or a second resistance value larger thanthe first resistance value. The first output buffer 412_1 and the secondoutput buffer 412_2 may drive the first pad PAD1 and the second pad PAD2with a power supply voltage VDD corresponding to “high” when theiroutput values are “high”, and may drive the first pad PAD1 and thesecond pad PAD2 with a ground voltage VSS corresponding to “low” whentheir output values are “low”. The third output buffer 422_1 and thefourth output buffer 422_2 may be controlled in their resistance valueby second resistance information R_INF2, and may drive the third padPAD3 and the fourth pad PAD4 in a method similar to the method by thefirst output buffer 412_1 and the second output buffer 412_2.Additionally, the first semiconductor device 410 may include a pad and athrough via for applying the first resistance information R_INF1, andthe second semiconductor device 420 may include a pad and a through viafor applying the second resistance information R_INF2. Illustration ofthese pads and through vias is omitted for the sake of convenience.

In the via test operation, the resistance value of the output buffers412_1 and 412_2 of the first semiconductor device 410 is set to a firstresistance value, and the resistance value of the output buffers 422_1and 422_2 of the second semiconductor device 420 is set to a secondresistance value.

Next, as the first semiconductor device 410 performs the serial inputoperation, the respective bits of the data inputted in series throughthe first test input pad TI_PAD1 may be stored in the first storage unit415_1 and the second storage unit 415_2. For example, where “0” and “1”are sequentially inputted, “0” may be stored in the second storage unit415_2, and “1” may be stored in the first storage unit 415_1. Forreference, the data inputted through the first test input pad TI_PAD1may be data with a preset pattern. As the second semiconductor device420 performs the serial input operation, the respective bits of the datainputted in series through the second test input pad TI_PAD2 may bestored in the third storage unit 425_1 and the fourth storage unit425_2. The data stored in the second semiconductor device 420 and thedata stored in the first semiconductor device 410 may have differentpatterns. Particularly, the data stored in the second semiconductordevice 420 and the data stored in the first semiconductor device 410 mayhave opposite patterns. For example, “1” and “0” may be sequentiallyinputted to the second test input pad TI_PAD2, and “1” may be stored inthe fourth storage unit 425_2 and “0” may be stored in the third storageunit 425_1.

The first semiconductor device 410 and the second semiconductor device420 may simultaneously perform the parallel output operation. The firstpad PAD1 and the second pad PAD2 may be driven by the first outputbuffer 412_1 and the second output buffer 412_2, which have the firstresistance value, and the third pad PAD3 and the fourth pad PAD4 may bedriven by the third output buffer 422_1 and the fourth output buffer422_2, which have the second resistance value.

If the pads PAD1 to PAD4 are driven to specified voltages by the outputbuffers 412_1, 412_2, 422_1 and 422_2 as described above, the secondsemiconductor device 420 may perform the parallel input operation andmay update the data stored in the third storage unit 425_1 and thefourth storage unit 425_2, as values corresponding to the voltages ofthe third pad PAD3 and the fourth pad PAD4.

Finally, as the second semiconductor device 420 performs the serialoutput operation, the data stored in the fourth storage unit 425_2 andthe data stored in the third storage unit 425_1 may be sequentiallyoutputted. By comparing the data sequentially inputted through the firsttest input pad TI_PAD1 and the data sequentially outputted through thesecond test output pad TO_PAD2, if the data are the same with eachother, it may be determined that the through vias TSV1 and TSV2 arenormally formed. By comparing the data sequentially inputted through thesecond test input pad TI_PAD2 and the data sequentially outputtedthrough the second test output pad TO_PAD2, if the data have oppositepatterns, it may be determined that the through vias TSV1 and TSV2 arenormally formed. To compare the two data, the semiconductor system mayinclude separate storage units (not shown) in the semiconductor devicesor may include test equipment (not shown), which is connected with thesemiconductor devices 410 and 420. When the data are different from eachother as a comparison result, it may be determined that the through viasTSV1 and TSV2 are not normally formed.

In the semiconductor system of FIG. 4, when the through vias TSV1 andTSV2 are not normally formed, the data stored in the secondsemiconductor device 420 are not the same as the data outputted from thefirst semiconductor device 410 and have values that are originallystored in the second semiconductor device 420. Therefore, a precise testresult may be obtained regardless of whether or not the through viasTSV1 and TSV2 are normally formed.

The semiconductor system may test whether or not through vias arenormally formed, using the circuits which perform the predeterminedoperations as described above. Since the circuits are circuits forperforming a boundary scan test, the semiconductor system mayefficiently perform a via test operation using circuits which areincluded for another test.

FIG. 5 is a diagram describing the principle of a via test operation inthe semiconductor system of FIG. 4.

FIG. 5 shows only the first pad PAD1, the first output buffer 412_1, thefirst storage unit 415_1, the first through via TSV1, the third padPAD3, the third output buffer 422_1, and the third storage unit 425_1.In the via test operation, the first output buffer 412_1 has the firstresistance value, and the third output buffer 422_1 has the secondresistance value. Accordingly, in FIG. 5, there are shown equivalentcircuits in which the first output buffer 412_1 includes two resistorsR1 and R2 having the first resistance value and switching elements S1and S2 and the third output buffer 422_1 includes two resistors R3 andR4 having the second resistance value and switching elements S3 and S4.

An operation for updating the value stored in the third storage unit425_1 in the via test operation will be described with reference to FIG.5.

It is presumed that “high” is stored in the first storage unit 415_1 and“low” is stored in the third storage unit 425_1. In the parallel outputoperation, the first storage unit 415_1 and the third storage unit 425_1may output stored values through output terminals Q. The first outputbuffer 412_1 may drive the first pad PAD1 to the power supply voltageVDD in response to the “high” outputted from the first storage unit415_1, for example, the switching element S1 is turned on and theswitching element S2 is turned off. The third output buffer 422_1 maydrive the third pad PAD3 to the ground voltage VSS in response to the“low” outputted from the third storage unit 425_1, for example, theswitching element S3 is turned off and the switching element S4 isturned on.

The terminal of the power supply voltage VDD of the first output buffer412_1 and the terminal of the ground voltage VSS of the third outputbuffer 422_1 may be electrically connected. The resistor R1, the firstthrough via TSV1 and the resistor R4 may be connected in series betweenthe terminal of the power supply voltage VDD of the first output buffer412_1 and the terminal of the ground voltage VSS of the third outputbuffer 422_1. It is presumed that the first resistance value isR_(VAL1), the second resistance value is R_(VAL2), and the resistancevalue of the first through via TSV1 is R_(TSV). R_(TSV) may benegligibly smaller than R_(VAL1) and R_(VAL2) when the first through viaTSV1 is normally formed, and may become markedly larger than R_(VAL1)and R_(VAL2) when the first through via TSV1 is not normally formed.Voltage V_(PAD3) of the third pad PAD3 is expressed as in the following[Mathematical Equation 1]. For reference, a voltage corresponding to“high” is the power supply voltage VDD, and a voltage corresponding to“low” is the ground voltage VSS.

$\begin{matrix}{V_{{PAD}\; 3} = {\frac{R_{{VAL}\; 2}}{R_{{VAL}\; 1} + R_{TSV} + R_{{VAL}\; 2}}( {{VDD} - {VSS}} )}} & \lbrack {{Mathematical}\mspace{14mu} {Equation}\mspace{14mu} 1} \rbrack\end{matrix}$

In [Mathematical Equation 1], since R_(TSV) is negligibly smaller thanR_(VAL1) and R_(VAL2) when the first through via TSV1 is normally formedand since R_(VAL1) < R_(VAL2), the voltage V_(PAD3) of the third padPAD3 has a voltage close to the “high” stored in the first storage unit415_1. Therefore the value stored in the third storage unit 425_1 may beupdated from “low” to “high”. Since R_(TSV) is markedly larger thanR_(VAL1) and R_(VAL2) when the first through via TSV1 is not normallyformed, the voltage V_(PAD3) of the third pad PAD3 has a voltage closeto the “low” stored in the third storage unit 425_1. Data correspondingto the voltage of the third pad PAD3 is buffered by the third inputbuffer 421_1 (not shown in FIG. 5) and is inputted to an input terminalD of the third storage unit 425_1. Accordingly, the value stored in thethird storage unit 425_1 may be updated from “low” to “high”.

Conversely, even in the case where “low” is stored in the first storageunit 415_1 and “high” is stored in the third storage unit 425_1 as aresult of the serial input operation, it may be determined that, througha similar operation procedure as described above, the voltage V_(PAD3)of the third pad PAD3 has a voltage close to the “low” stored in thefirst storage unit 415_1 when the first through via TSV1 is normallyformed and the voltage V_(PAD3) of the third pad PAD3 has a voltageclose to the “high” stored in the third storage unit 425_1 when thefirst through via TSV1 is not normally formed.

That is, when the parallel output operation is performed after differentlogic values are stored in the corresponding first storage unit 415_1and third storage unit 425_1, the voltage V_(PAD3) of the third pad PAD3has a voltage corresponding to the value outputted from the firststorage unit 415_1 when the first through via TSV1 is normally formed,and has a voltage corresponding to the value outputted from the thirdstorage unit 425_1 when the first through via TSV1 is not normallyformed. Therefore, in the serial input operation, if the value stored inthe third storage unit 425_1 and the value updated through the parallelinput operation are the same, it is determined that the first throughvia TSV1 is not normally formed, and, if the value stored in the thirdstorage unit 425_1 and the value updated through the parallel inputoperation are different, it is determined that the first through viaTSV1 is normally formed. In the semiconductor system of FIG. 4, eventhough the first through via TSV1 is not normally formed and thus thethird pad PAD3 is floated, the via test operation may be stablyperformed.

FIG. 6 is a diagram illustrating a semiconductor system in accordancewith an embodiment of the present invention.

Referring to FIG. 6, a semiconductor system may include first to N^(th)semiconductor devices 610, CHIPs and 620. The first to N^(th)semiconductor devices 610, CHIPs and 620 may be stacked. In thesemiconductor system, the first semiconductor device 610 may be anuppermost stacked semiconductor device, the N^(th) semiconductor device620 may be a lowermost stacked semiconductor device, and the remainingsemiconductor devices CHIPs may be semiconductor devices which arestacked between the first semiconductor device 610 and the N^(th)semiconductor device 620. Each of the first to N^(th) semiconductordevices 610, CHIPs and 620 may include a plurality of pads P. Thepluralities of pads P of the semiconductor devices stacked adjacent toeach other may be connected through the through vias TSV. FIG. 6 showsonly respective pads P, TI and TO and through vias TSV of the first andN^(th) semiconductor devices 610 and 620 and the stacked shape of theremaining semiconductor devices CHIPs.

FIG. 7 is a diagram illustrating the first semiconductor device 610shown in FIG. 6. Referring to FIG. 7, the first semiconductor device 610may include pads P, a test input pad TI, a test output pad TO, inputbuffers IB, output buffers OB, a test input buffer TIB, a test outputbuffer TOB, storage units DFF, selection units MUX1 and MUX2, a testcontrol unit TCON, and an internal circuit ICIR.

In the first semiconductor device 610 of FIG. 7, the resistance value ofthe output buffers OB may be controlled. Even in the remainingsemiconductor devices CHIPs and 620, the resistance value of the outputbuffers OB may be controlled. The resistance value of the output buffersOB of the first semiconductor device 610 may be determined in responseto resistance information R_INF, and may have a first resistance valueor a second resistance value larger than the first resistance value. Ina via test operation, the resistance values of the output buffers OB ofthe first semiconductor device 610 and the output buffers OB of theN^(th) semiconductor device 620 may be set differently from each other.

The configuration and operation of the first semiconductor device 610 ofFIG. 7 may be similar to the configuration and operation of the firstsemiconductor device 210 of FIG. 3, and the configurations andoperations of the remaining semiconductor devices CHIPs and 620 of FIG.6 may be the same as the configuration and operation of the firstsemiconductor device 610 of FIG. 7. The semiconductor devices 610, CHIPsand 620 of FIG. 6 may perform (1) a serial input operation, (2) a serialoutput operation, (3) a parallel input operation, and (4) a paralleloutput operation according to the control thereof, similar to the firstsemiconductor device 210 of FIG. 3. Hereinbelow, descriptions will bemade mainly for the output buffers OB of the first semiconductor device610 and the N^(th) semiconductor device 620 and the via test operation.

In the via test operation, the resistance value of the output buffers OBof the first semiconductor device 610 may be set to a first resistancevalue, and the resistance value of the output buffers OB of the N^(th)semiconductor device 620 may be set to a second resistance value.

Next, as the first semiconductor device 610 performs the serial inputoperation the data serially inputted through the test input pad TI maybe stored in the plurality of storage units DFF. Similarly, as theN^(th) semiconductor device 620 performs the serial input operation, thedata serially inputted through the test input pad TI may be stored inthe plurality of storage units DFF. For reference, the data inputtedthrough the test input pad TI may be data with a preset pattern. Thepattern of the data inputted to and stored in the first semiconductordevice 610 and the pattern of the data inputted to and stored in theN^(th) semiconductor device 620 may be opposite to each other.

Then, the first semiconductor device 610 may perform the parallel outputoperation, and the N^(th) semiconductor device 620 may perform theparallel output operation. The remaining semiconductor devices CHIPs mayperform the parallel input operation. As the N^(th) semiconductor device620 performs the parallel input operation and stores data correspondingto the voltages of the plurality of pads P in the plurality of storageunits DFF, the values stored in the plurality of storage units DFF maybe updated. The values of data to be stored in the plurality of storageunits DFF are determined similarly as described above with reference toFIG. 5. The pads P of the first semiconductor device 610 correspond tothe first pad PAD1, and the pads P of the N^(th) semiconductor device620 correspond to the third pad PAD3. Particularly, in [MathematicalEquation 1], R_(TSV) may correspond to the resistance, value of theentire through vias TSV connected between the pads P of the firstsemiconductor device 610 and the pads P of the N^(th) semiconductordevice 620 but not to the resistance value of one through via.

Finally, as the N^(th) semiconductor device 620 performs the serialoutput operation, the data stored in the plurality of storage units DFFof the N^(th) semiconductor device 620 may be outputted in series. Whenthe data serially inputted through the test input pad TI of the firstsemiconductor device 610 and the data serially outputted through thetest output pad TO of the N^(th) semiconductor device 620 have the samepattern, it may be determined that the through vias TSV are normallyformed. Otherwise, when the data serially inputted through the testinput pad TI of the N^(th) semiconductor device 620 and the dataserially outputted through the test output pad TO of the N^(th)semiconductor device 620 have the same pattern, it may be determinedthat the through vias TSV are normally formed. When data patterns arepartially different from each other, it may be determined that a throughvia TSV corresponding to a storage unit DFF which has caused thedifference in the data patterns is not normally formed.

The semiconductor system may test whether or not through vias arenormally formed, using the circuits, which perform the predeterminedoperations as described above. Since the circuits are for performing aboundary scan test, the semiconductor system may efficiently perform avia test by performing a via test operation using circuits, which areincluded for another test.

FIG. 8 is a diagram illustrating the output buffer 412_1.

As shown in FIG. 8, the output buffer 412_1 may include a plurality ofresistor elements RA to RD and a plurality of switching sections 810 to840. Among the plurality of resistor elements RA to RD, the resistorelements RA and RB may have a first resistance value, and the resistorelements RC and RD may have a second resistance value. Among theplurality of resistor elements RA to RD, the resistor elements RA and RCmay be connected to the terminal of a power supply voltage VDD, and theresistor elements RB and RD may be connected to the terminal of a groundvoltage VSS.

When an output signal OUT is deactivated, the output buffer 412_1 may bedeactivated. When the output signal OUT is activated, the output buffer412_1 may drive an output node O in response to the data inputtedthrough an input node I.

When the output signal OUT is activated and the resistance value of theoutput buffer 412_1 is set to the first resistance value by theresistance information R_INF, the first switching section 810 and thesecond switching section 820 may be activated, and the third switchingsection 830 and the fourth switching section 840 may be deactivated.When outputting “high” to the output node O, the first switching section810 may be turned on and the output node O may be pull-up driven to thepower supply voltage VDD, and in the case of outputting “low” to theoutput node O, the second switching section 820 may be turned on and theoutput node O may be pull-down driven to the ground voltage VSS.

When the output signal OUT is activated and the resistance value of theoutput buffer 412_1 is set to the second resistance value by theresistance information R_INF, the third switching section 830 and thefourth switching section 840 may be activated, and the first switchingsection 810 and the second switching section 820 may be deactivated.When outputting “high” to the output node O, the third switching section830 may be turned on and the output node O may be pull-up driven to thepower supply voltage VDD, and when outputting “low” to the output nodeO, the fourth switching section 840 may be turned on and the output nodeO may be pull-down driven to the ground voltage VSS.

In addition to the output buffer 412_1, the output buffers 412_2, 422_1and 422_2 may be configured in substantially the same manner as shown inFIG. 8, and may operate as described above with reference to FIG. 8. Theconfiguration and operation of an output buffer may be designeddifferently according to a target resistance value to be set.

According to the embodiments of the present disclosure, it is possibleto test whether or not through vias connecting the semiconductor devicesincluded in a semiconductor system are normally formed.

According to the embodiments of the present disclosure, since a test isperformed using a circuit included in a semiconductor device, a circuitarea necessary for testing through vias may be minimized, thus, it ispossible to perform an efficient test.

Although various embodiments have been described for illustrativepurposes, it will be apparent to those skilled in the art that variouschanges and modifications may be made without departing from the spiritand scope of the invention as defined in the following claims.

1. A semiconductor system comprising: a first semiconductor deviceincluding a first pad, a second pad and a first test input pad, andsuitable for storing data inputted in series through the first testinput pad and outputting the stored data in parallel through the firstpad and the second pad; a second semiconductor device including a thirdpad, a fourth pad and a second test output pad, and suitable for storingdata inputted in parallel through the third pad and the fourth pad; afirst through via connecting the first pad and the third pad; and asecond through via connecting the second pad and the fourth pad.
 2. Thesemiconductor system according to claim 1, wherein the secondsemiconductor device outputs in series the stored data through thesecond test output pad.
 3. The semiconductor system according to claim2, wherein the data inputted to the first semiconductor device throughthe first test input pad and the data outputted from the secondsemiconductor device through the second test output pad are compared. 4.The semiconductor system according to claim 1, wherein the firstsemiconductor device further comprises: a first test output pad; a firstselection unit suitable for selecting one of the data inputted throughthe first test input pad and data inputted through the first pad; afirst storage unit suitable for storing and outputting the data selectedby the first selection unit; a second selection unit suitable forselecting one of the data outputted from the first storage unit and dataoutputted from a first internal circuit; a third selection unit suitablefor selecting one of the data outputted from the first storage unit anddata inputted through the second pad; a second storage unit suitable forstoring and outputting the data selected by the third selection unit;and a fourth selection unit suitable for selecting one of the dataoutputted from the second storage unit and the data outputted from thefirst internal circuit, wherein the data outputted from the secondstorage unit are transferred to the first test output pad.
 5. Thesemiconductor system according to claim 4, wherein, when the datainputted through the first test input pad are stored in the firstsemiconductor device, the first selection unit selects the data inputtedthrough the first test input pad and the third selection unit selectsthe data outputted from the first storage unit, and wherein, when thedata stored in the first semiconductor device are outputted through thefirst pad and the second pad, the second selection unit selects the dataoutputted from the first storage unit, and the fourth selection unitselects the data outputted from the second storage unit.
 6. Thesemiconductor system according to claim 4, wherein the secondsemiconductor device comprises: a second test input pad; a fifthselection unit suitable for selecting one of data inputted through thesecond test input pad and data inputted through the third pad; a thirdstorage unit suitable for storing and outputting the data selected bythe fifth selection unit; a sixth selection unit suitable for selectingone of the data outputted from the third storage unit and data outputtedfrom a second internal circuit; a seventh selection unit suitable forselecting one of the data outputted from the third storage unit and datainputted through the fourth pad; a fourth storage unit suitable forstoring and outputting the data selected by the seventh selection unit;and an eighth selection unit suitable for selecting one of the dataoutputted from the fourth storage unit and the data outputted from thesecond internal circuit, wherein the data outputted from the fourthstorage unit are transferred to the second test output pad.
 7. Thesemiconductor system according to claim 6, wherein, when the datainputted through the third pad and the fourth pad are stored in thesecond semiconductor device, the fifth selection unit selects the datainputted through the third pad and the seventh selection unit selectsthe data inputted through the fourth pad, and wherein, when data storedin the second semiconductor device are outputted through the second testoutput pad, the eighth selection unit selects the data outputted fromthe fourth storage unit.
 8. The semiconductor system according to claim1, wherein the first semiconductor device transfers the data inputtedthrough the first pad and the second pad, to the first internal circuitin a data input operation, and outputs data transferred from the firstinternal circuit to the first pad and the second pad in a data outputoperation, and wherein the second semiconductor device transfers thedata inputted through the third pad and the fourth pad, to the secondinternal circuit in a data input operation, and outputs data transferredfrom the second internal circuit to the third pad and the fourth pad ina data output operation.
 9. A semiconductor system comprising: first toNth semiconductor devices each including a plurality of pads, the firstto Nth semiconductor devices being sequentially stacked such that theplurality of pads of adjacent semiconductor devices are connected toeach other by through vias, respectively, wherein the firstsemiconductor device further includes a test input pad, stores datainputted in series through the test input pad, and outputs in parallelthe stored data through corresponding pads among the plurality of pads,and wherein the Nth semiconductor device further includes a test outputpad, stores the data inputted in parallel through the corresponding padsamong the plurality of pads, and outputs in series the stored datathrough the test output pad.
 10. The semiconductor system according toclaim 9, wherein the data inputted to the first semiconductor devicethrough the test input pad and the data outputted from the Nthsemiconductor device through the test output pad are compared. 11-24.(canceled)